CV Information
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Grant's Name,"Project's Title" (Research Period)(Role)[Sponsorship]
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1 | EXTERNAL GRANT INDUSTRY (BJIM), "FLUID STRUCTURE INTERACTION(FSI) ANALYSIS OF THE EFFECT OF DIE THICKNESS AND ASPECT RATIO OF STACKED CHIP IN WAFER MOLD ENCAPSULATION PROCESS" (15.07.2024 - 14.07.2027) (Principal) [ INTEL ELECTRONICS (MALAYSIA) SDN. BHD. ] - Source: eR&I |