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PROFESOR MADYA DR. ABDULLAH AZIZ BIN SAAD
EXPERT IN

ENGINEERING

SCHOOL OF MECHANICAL ENGINEERING
Engineering Campus
UNIVERSITI SAINS MALAYSIA (USM)
Starting Date in USM: 15 March 2012
azizsaad@usm.my
+6(04) 599 (Ext) 6300
https://experts.usm.my/cvitae/azizsaad
  • B ENG (HONS), KEJURUTERAAN MEKANIK
    UNIVERSITI SAINS MALAYSIA (USM) (MALAYSIA)
  • MASTER OF SCIENCE, KEJURUTERAAN MEKANIK
    UNIVERSITI SAINS MALAYSIA (USM) (MALAYSIA)
  • PhD, KEJURUTERAAN MEKANIK
    THE UNIVERSITY OF NOTTINGHAM, UNITED KINGDOM (BRITAIN)
BIOGRAPHY
Abdullah Aziz Saad is an Associate Professor at the USM School of Mechanical Engineering. He obtained his PhD in Mechanical Engineering from the University of Nottingham, UK, in 2012 and has been with USM since. He is currently serving as Dean of the School for the 2025–2027 term, focusing on strengthening academic, research, and industry engagement. He regularly teaches undergraduate courses in applied mechanics, e.g. solid mechanics & dynamics.
RESEARCH INTERESTS
His research interests include mechanics of materials (plasticity, creep, and fatigue), finite element analysis, and electronic packaging, with a focus on the mechanical behaviour of lead-free solders and electronics materials. He likes to take part in NGO activities that promote education and help people who are less fortunate. Also, he is committed to advancing the school’s social innovation agenda to deliver meaningful impact to the community.
Scopus ID
55605224100
Researcher ID
E-1576-2012
ORCID
0000-0002-3791-6368
Google Scholar ID
5G6-Nm8AAAAJ
EXPERTISE
  1. ENGINEERING >> Computational Engineering > Computational Solid Mechanics
  2. ENGINEERING >> Engineering Mechanics > Mechanics of Materials
  3. ENGINEERING >> Mechanical Engineering Technology > Stress Analysis
  4. ENGINEERING >> Mechanical Engineering Technology > Metal and Non-Metal Joining Technology (Liquid-Solid-State Joining including Welding, Brazing, Soldering, and Adhesive Bonding. Mechanical Joining including Fasteners, Bolts, Nuts and Screws)
  5. APPLIED SCIENCE AND TECHNOLOGY >> Electronics and Photonics Materials > Electronic Packaging Materials
SDG (Research Grants)
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